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Semiconductor thinning grinding wheel

ZZSM can provide three types of thinning grinding wheels: vitrified bond, resin bond and metal bond. The grinding wheel has excellent performance, good grinding surface quality and high cost performance, which can replace imported products. According to the characteristics and size of the processing materials and the equipment used, we can provide suitable overall solutions such as grinding wheels and grinding processes, which can meet the needs of the diversified development of different semiconductor materials and processing grinding machines.

Product Introduction

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    • Commodity name: Semiconductor thinning grinding wheel

    ZZSM can provide three types of thinning grinding wheels: vitrified bond, resin bond and metal bond. The grinding wheel has excellent performance, good grinding surface quality and high cost performance, which can replace imported products. According to the characteristics and size of the processing materials and the equipment used, we can provide suitable overall solutions such as grinding wheels and grinding processes, which can meet the needs of the diversified development of different semiconductor materials and processing grinding machines.

     

     

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  • It is mainly used for grinding and thinning of semiconductor material substrates and wafers such as silicon, silicon carbide, gallium arsenide, indium phosphide, sapphire, etc.

  • Thinning grinding wheels are mainly used for thinning and finish grinding semiconductor wafers. They can replace imported products and stably used with the Japanese, Germany, American, South Korean and domestic grinding machines, with superior grinding performance and high cost performance.