Your location:

Picture Name

Ultra-High Thermal Conductivity Diamond

Ultra-high thermal conductivity diamond has the characteristics of high mechanical strength, good insulation, low dielectric constant and light weight, and the thermal conductivity at room temperature is more than 5 times that of copper, which can enable semiconductor devices to obtain higher power density and improve reliability in a smaller space. It is the best thermal management material for heat dissipation of high heat flux devices.

Product Introduction

  • 详情
  • Product Image
  • Uses
  • Product Features
    • Commodity name: Ultra-High Thermal Conductivity Diamond

    Ultra-high thermal conductivity diamond has the characteristics of high mechanical strength, good insulation, low dielectric constant and light weight, and the thermal conductivity at room temperature is more than 5 times that of copper, which can enable semiconductor devices to obtain higher power density and improve reliability in a smaller space. It is the best thermal management material for heat dissipation of high heat flux devices.

    Overall introduction

    Ultra-high thermal conductivity diamond has the characteristics of high mechanical strength, good insulation, low dielectric constant and light weight, and the thermal conductivity at room temperature is more than 5 times that of copper, which can enable semiconductor devices to obtain higher power density and improve reliability in a smaller space. It is the best thermal management material for heat dissipation of high heat flux devices.

  • It can be applied to high-power RF devices such as RF amplifiers and microwave amplifiers, high-power devices such as high-power laser tube diodes, laser tube diode arrays, and high-power transistors, as well as compound semiconductor devices such as GaN, GaA, and SiC.

  • The ultra-high thermal conductivity diamond produced by ZZSM has the characteristics of high mechanical strength, good insulation, low dielectric constant and light weight, and the thermal conductivity at room temperature is more than 5 times that of copper, which can make semiconductor devices obtain higher power density and improve reliability in a smaller space. It is the best thermal management material for heat dissipation of high heat flux devices.

     

    Size: 1-4 inches (size and shape can be customized according to customer needs)

    The thermal conductivity at room temperature is 1200-2000W/m·K

    生长方法Growth method

    MPCVD

    尺寸 size

    1-4英寸;可定制

    厚度thickness

    0.3-1.0mm,可定制

    热导率Thermal conductivity

    1200-2000W/mK@300K;可定制

    热膨胀系数Coefficient of thermal expansion

    1×10-6/K@300K

    比热容Specific heat capacity

    0.502J/gK@300K

    密度density

    3.52×103Kg·m-3

    维氏硬度Vickers hardness

    80-100GPa

    杨氏模量Young's modulus

    1050GPa

    厚度公差Thickness tolerances

    ±0.05 mm

    厚度变化Thickness variation

    TTV< 30μm

    弯曲度Curvature

    Bow< 50μm@4inchBow< 30μm@2inch

    翘曲度Warpage

    Warp< 100μm@4inchWarp< 50μm@2inch

    粗糙度-形核面Roughness - Nucleated surface

    Ra < 10nm

    粗糙度-生长面Roughness - growth surface

    Ra < 30nm