Your location:

Picture Name

Ultra-thermally conductive diamond

Ultra-high thermal conductivity diamond has the characteristics of high mechanical strength, good insulation, low dielectric constant and light weight, and the thermal conductivity at room temperature is more than 5 times that of copper, which can make semiconductor devices obtain higher power density and improve reliability in a smaller space, and is the best thermal management material for high heat flux device heat dissipation.

Product Introduction

  • 详情
  • Product Image
  • Uses
  • Product Features
    • Commodity name: Ultra-thermally conductive diamond

    Ultra-high thermal conductivity diamond has the characteristics of high mechanical strength, good insulation, low dielectric constant and light weight, and the thermal conductivity at room temperature is more than 5 times that of copper, which can make semiconductor devices obtain higher power density and improve reliability in a smaller space, and is the best thermal management material for high heat flux device heat dissipation. <br>

  • It can be used in high-power RF devices such as RF amplifier and microwave amplifier, high-power laser tube diode, laser tube diode array, high-power transistor and other high-power devices, as well as GaN, GaA, SiC and other compound semiconductor devices.

  • The ultra-high thermal conductivity diamond produced by Sanmo has the characteristics of high mechanical strength, good insulation, low dielectric constant and light weight, and the thermal conductivity at room temperature is more than 5 times that of copper, which can make semiconductor devices obtain higher power density and improve reliability in a smaller space, and is the best thermal management material for heat dissipation of high heat flux devices.

    Size 1-4 inches (size, shape can be customized according to customer needs)
    Room temperature thermal conductivity 1200-2000W/m·K

    Growth method

    MPCVD

    dimension

    1-4inches;customizable

    thickness

    0.3-1.0mm,customizable

    Thermal conductivity

    1200-2000W/mK@300K;customizable

    Coefficient of thermal expansion

    1×10-6/K@300K

    Specific Heat Capacity

    0.502J/gK@300K

    density

    3.52(×103Kg·m-3)

    Vickers hardness

    80-100GPa

    Young's modulus

    1050GPa

    Thickness tolerance

    ±0.05 mm

    Thickness variation

    TTV< 30μm

    curvature

    Bow< 50μm@4inch;Bow< 30μm@2inch

    Warping degree

    Warp< 100μm@4inch;Warp< 50μm@2inch

    Roughness - nucleating surface

    Ra < 10nm

    Roughness - growth surface

    Ra < 30nm

Related Products