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Semiconductor edge grinding wheel

ZZSM offers two types of diamond edge grinding wheels : metal bond and resin bond. Through the self-created multi-system grinding wheel formula library, there are different design schemes for different hard and brittle materials such as semiconductor wafers and ultra-thin liquid crystal glass, and different dimensional precision processing, which can be accurately matched and can meet the ultra-precision and ultra-high surface quality requirements of edge grinding processing.

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    • Commodity name: Semiconductor edge grinding wheel

    ZZSM offers two types of diamond edge grinding wheels : metal bond and resin bond. Through the self-created multi-system grinding wheel formula library, there are different design schemes for different hard and brittle materials such as semiconductor wafers and ultra-thin liquid crystal glass, and different dimensional precision processing, which can be accurately matched and can meet the ultra-precision and ultra-high surface quality requirements of edge grinding processing.

  • It is mainly used for edge grinding of semiconductor wafers such as silicon, silicon carbide, gallium nitride, gallium arsenide, germanium, sapphire and ultra-thin liquid crystal glass.

  • It is mainly used for edge grinding of various glass and products, including ITO glass, PDP glass, quartz glass, glass-ceramic, photovoltaic and automotive glass, etc., especially for grinding sapphire substrates, silicon carbide substrates and silicon wafers, which has the leading level in China.