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Dicing blades

ZZSM dicing blades has ultra high strength though with ultra thin thickness. The dicing blades with the thinnest blade 10-15 microns and the thickest more than 100 microns can meet various block streets and die size to realize high-quality dicing of ultra-thin silicon wafers and small-size silicon wafers, avoid burrs or cracking, and effectively solve the problem of back chipping.

Product Introduction

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    • Commodity name: Dicing blades

    ZZSM dicing blades has ultra high strength though with ultra thin thickness. The dicing blades with the thinnest blade 10-15 microns and the thickest more than 100 microns can meet various block streets and die size to realize high-quality dicing of ultra-thin silicon wafers and small-size silicon wafers, avoid burrs or cracking, and effectively solve the problem of back chipping.

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  • It is mainly used for dicing wafers to separate individual chips from each other. It is suitable for dicing semiconductor silicon wafers, compound semiconductor wafers (GaAs, GaP, etc.), oxide semiconductor wafers (LiTaO3, etc.), etc., as well as various semiconductors such as alumina ceramics, EMC (thermosetting resin), PCB (printed circuit board), and other semiconductor package substrate.

  • With electroplated nickel bond, the ultra-thin dicing blade has ultra-high strength could meets the dicing needs of narrow streets of semiconductor wafers. 

    In recent years, we developed a new dicing blade for GaAs wafers of red and yellow LED chips, with a minimum die size 75x75 microns, achieving excellent cutting quality, with a maximum 2,800 meters life and one blade can cut more than 10 million light-emitting chips.