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Ceramic block / Ceramic polishing plate

The ceramic block has the characteristics of high flat accuracy, high morphological accuracy and high service life, and the whole process of product production is reliable and stable, which realizes the excellent service performance of the product under different working conditions, effectively solves many problems such as electrode crushing, cracking disc, poor corrosion resistance, etc., realizes the good CMP polishing quality of semiconductor wafer materials in practical applications, breaks through the technical monopoly of foreign manufacturers, and successfully realizes domestic substitution.

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    • Commodity name: Ceramic block / Ceramic polishing plate

    The ceramic block has the characteristics of high flat accuracy, high morphological accuracy and high service life, and the whole process of product production is reliable and stable, which realizes the excellent service performance of the product under different working conditions, effectively solves many problems such as electrode crushing, cracking disc, poor corrosion resistance, etc., realizes the good CMP polishing quality of semiconductor wafer materials in practical applications, breaks through the technical monopoly of foreign manufacturers, and successfully realizes domestic substitution.

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  • It is mainly used for thinning, hard polishing and CMP polishing processes of LED substrates and semiconductor wafers (sapphire wafers, silicon carbide wafers, silicon wafers, germanium wafers, gallium arsenide wafers, gallium nitride wafers, etc.) and other material wafers and windows.

  • ZZSM can provide ceramic blocks according to the customized needs of customers, diameter range: Φ5~800mm, thickness: 1~200mm, flatness: 0.001~0.002mm. We can design and manufacture various non-standard ceramic blocks according to customer requirements.