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Ceramic chuck table

The ceramic chuck table has the characteristics of high flatness and parallelism, compact and uniform structure, high strength, good air permeability, uniform adsorption force, easy dressing, etc. They are used in the processing of 2, 3, 4, 5, 6, 8 and 12 inch semiconductor wafers.

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    • Commodity name: Ceramic chuck table

    The ceramic chuck table has the characteristics of high flatness and parallelism, compact and uniform structure, high strength, good air permeability, uniform adsorption force, easy dressing, etc. They are used in the processing of 2, 3, 4, 5, 6, 8 and 12 inch semiconductor wafers.

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  • It is widely used in the manufacturing of semiconductor wafers such as silicon, sapphire, gallium arsenide, etc. Ceramic chuck tables are divided into chamfering, dicing, thinning and testing chucks according to different processing processes.

  • The whole process of chuck table is reliable and stable, which realizes the excellent application performance of the product under different working conditions, effectively solves many problems such as wafer imprint, chip electrostatic breakdown, particle pollution, etc., realizes the extremely high processing quality of semiconductor wafers in practical applications, breaks through the technical monopoly of foreign manufacturers, and successfully realizes domestic substitution, with good product performance and market reputation.

    Ceramic chuck table for chamfering: good wear resistance, good rigidity and strong adsorption force;

    Ceramic chuck table for dicing: high precision, uniform adsorption force, good cutting quality;

    Ceramic chuck tables for thinning: high specific stiffness, low thermal expansion and long service life;

    Ceramic chuck tables for detection: strong regional adsorption, good light absorption and excellent antistatic properties.