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Sanmo superhard material grinding wheel for semiconductor chip cutting was approved as the seventh batch of manufacturing single champion products

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Recently, the Ministry of Industry and Information Technology and the China Federation of Industrial Economics organized the cultivation and selection of the seventh batch of individual champion enterprises (products) in the manufacturing industry, and the relevant review has been completed. On November 10, the Ministry of Industry and Information Technology and the China Federation of Industrial Economics announced the list of the seventh batch of manufacturing individual champion enterprises (products), and Sanmo stood out among many enterprises with strong technological innovation ability and leading product market share advantages, and won this honor.

Manufacturing individual champion refers to the long-term focus on some specific segments of the manufacturing industry product market, the production technology or process of the international leader, a single product market share in the world's top enterprises and products, cultivating a single manufacturing champion, is one of the important contents of promoting the high-quality development of manufacturing industry.

Semiconductor chips are the core and foundation of information technology industry, is an important guarantee of information technology, widely used in aerospace, national defense equipment, transportation equipment, consumer electronics and other high-end manufacturing fields. Superhard material for semiconductor chip cutting grinding wheel is a necessary tool for cutting semiconductor chip packaging materials. As the only comprehensive research institution in the industry, Sanmo has long been committed to the research and development and industrialization of high-end superhard material products. Facing the urgent need of autonomous semiconductor chip manufacturing, Sanmo has carried out special technical research on theoretical design, preparation, processing and application of products for a long time, breaking through key technical problems such as near-net precision forming, metal base in-situ synchronous pressure self-spreading sintering, and cross method fast and efficient dressing. Developed resin bond, metal bond 2 class of multi-specification series of semiconductor packaging and cutting wheel products, manufacturing accuracy and performance reached the international advanced level, in the domestic sealing and testing enterprises to obtain batch stable application, with independent intellectual property rights, to achieve the semiconductor chip efficient precision cutting tools independent, domestic. It is of great significance to ensure the supply chain security of chip manufacturing industry.


Metal bond ultra-thin cutting wheel


Resin bonded ultra-thin cutting wheel




The single manufacturing champion product approved this time is another strength certification highlighting the core competitiveness of the enterprise after Sanmo was approved as the "National technological Innovation demonstration enterprise" honor in 2021, which is an affirmation of Sanmo's technological innovation ability, industry status, brand value and comprehensive strength of the enterprise, and puts forward higher requirements for adhering to the independent innovation of core technologies in the future. In the future, the company will further accelerate the pace of independent innovation, gather together to carry out original innovation and core technology research, climb the technological peak, and promote the high-quality development of China's superhard materials industry.

Correspondent: Zhang Yunhe