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Semiconductor package singulation blades

ZZSM can produce various types of singulation blades such as resin bond, metal bond and electroplated bond. Each bond has different characteristics, covering almost all the needs of the package dicing and singulation market. These series of singulation blades are reliable on the whole production technic to ensure stable quality, the thickness precision is controllable, the matrix of bond and abrasives is rich to get different cutting quality and efficiency requirements.

Product Introduction

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    • Commodity name: Semiconductor package singulation blades

    ZZSM can produce various types of singulation blades such as resin bond, metal bond and electroplated bond. Each bond has different characteristics, covering almost all the needs of the package dicing and singulation market. These series of singulation blades are reliable on the whole production technic to ensure stable quality, the thickness precision is controllable, the matrix of bond and abrasives is rich to get different cutting quality and efficiency requirements.

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  • It is mainly used for high-speed, high-efficiency precision slotting and cutting off processing of various packaging devices such as QFN, DFN, BGA, MEMS, LED, PCB boards, ceramic substrates, etc., in the packaging and testing stage of semiconductor manufacturing.

  • Resin bond cutting wheels can improve the cutting quality; Sharp cutting can effectively reduce the dressing times or no need dressing; High cutting precision and wide range of applications; various specifications and short lead times.

    The metal bond cutting wheel has strong ability to hold abrasives, high precision, good wear resistance and shape retention, and long service life.